On-Chip Transient Hot Spot Detection with a Multiscale ROM in 3DIC Designs
Author:
Affiliation:
1. Ansys, Inc.,Canonsburg,PA,15317
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816679.pdf?arnumber=9816679
Reference15 articles.
1. EIA/JEDEC Standard JESD51 -6;Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air),1999
2. Fast and accurate thermal analysis of smartphone with dynamic power management using reduced order modeling
3. Transient thermal behavior of SOIC packages — an optimization study
4. The Time-Domain Vector Fitting Algorithm for Linear Macromodeling
5. An eigensystem realization algorithm for modal parameter identification and model reduction
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