Challenges in thermal modeling of electronics at the system level: summary of panel held at the Therminic 2000-Reference-Cited by-同舟云学术

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Challenges in thermal modeling of electronics at the system level: summary of panel held at the Therminic 2000

Published:2001 Issue:4 Volume:24 Page:611-613
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Joshi Y.,Baelmans A.,Copeland D.,Lasance C.J.M.,Parry J.,Rantala J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/21029/00974948.pdf?arnumber=974948

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. LES of heat transfer in electronics;Applied Mathematical Modelling;2012-07

3. Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens;Journal of Electronic Packaging;2012-03-01

4. SABER-Based Simulation for Compact Dynamic Electro-Thermal Modeling Analysis of Power Electronic Devices;Advanced Materials Research;2011-07

5. Experimental Study on Pressure Drop Characteristics of Vents;IEEE Transactions on Components and Packaging Technologies;2010-06

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