A 3nm CMOS FinFlex™ Platform Technology with Enhanced Power Efficiency and Performance for Mobile SoC and High Performance Computing Applications
Author:
Wu Shien-Yang1, Chang C.H.1, Chiang M.C.1, Lin C.Y.1, Liaw J.J.1, Cheng J.Y.1, Yeh J.Y.1, Chen H.F.1, Chang S.Y.1, Lai K.T.1, Liang M.S.1, Pan K.H.1, Chen J.H.1, Chang V.S.1, Luo T.C.1, Wang X.1, Mor Y.S.1, Lin C.I.1, Wang S.H.1, Hsieh M.Y.1, Chen C.Y.1, Wu B.F.1, Lin C.J.1, Liang C.S.1, Tsao C.P.1, Li C.T.1, Chen C.H.1, Hsieh C.H.1, Liu H.H.1, Chen P.N.1, Chen C.C.1, Chen R.1, Yeo Y.C.1, Chui C.O.1, Chang W.1, Lee T.L.1, Huang K.B.1, Lin H.J.1, Chen K.W.1, Tsai M.H.1, Chen K.S.1, Chen X.M.1, Cheng Y.K.1, Wang C.H.1, Shue W.1, Ku Y.1, Jang S. M.1, Cao M.1, Lu L.C.1, Chang T.S.1
Affiliation:
1. Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan, R.O.C
Cited by
21 articles.
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