Capacitance of a circular symmetric model of a via hole including finite ground plane thickness-Reference-Cited by-同舟云学术

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Capacitance of a circular symmetric model of a via hole including finite ground plane thickness

Published:1991-07 Issue:7 Volume:39 Page:1229-1234
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Kok P.,De Zutter D.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx1/22/2792/00085393.pdf?arnumber=85393

Cited by 49 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Use of Cavity Perturbation Techniques to Characterize Via-Plate Behavior;2023 IEEE/MTT-S International Microwave Symposium - IMS 2023;2023-06-11

2. Insertion Loss and Phase Compensation Using a Circular Slot Via-Hole in a Compact 5G Millimeter Wave (mmWave) Butler Matrix at 28 GHz;Sensors;2022-02-26

3. Optimization and Design of Passive Link with Single Channel 25 Gbps Based on High-Speed Backplane;Electronics;2021-07-24

4. Investigation of Various Commonly Associated Imperfections in Radiofrequency Micro-Electro-Mechanical System Devices and its Empirical Modeling;IETE Journal of Research;2021-02-08

5. 16- Layer PCB Channel Design with Minimum Crosstalk and Optimization of VIA and TDR Analysis;Journal of Electronic Testing;2019-07-04

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