LoRaWAN Sensors Integration for Manufacturing Applications via Edge Device Model with OPC UA-Reference-Cited by-同舟云学术

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LoRaWAN Sensors Integration for Manufacturing Applications via Edge Device Model with OPC UA

Published:2023-09-06 Issue: Volume: Page:
ISSN:
Container-title:2023 International Conference on Applied Electronics (AE)
language:
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Author:

Peniak Peter¹,Holečko Peter¹,Bubeníková Emília¹,Kanáliková Alžbeta²

Affiliation:

1. University of Žilina Žilina,Faculty of Electrical Engineering Engineering and Information Technology,Department of Control and Information Systems,Slovak Republic

2. University of Žilina,Faculty of Electrical Engineering and Information Technology,Department of Control and Information Systems,Žilina,Slovak Republic

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10274150/10274167/10274274.pdf?arnumber=10274274

Reference23 articles.

1. IoT Soil Monitoring based on LoRa Module for Oil Palm Plantation

2. Development of air temperature and soil moisture monitoring systems with LoRA technology

3. Future Trends for Healthcare Monitoring System in Smart Cities Using LoRaWAN-Based WBAN

4. Low-Cost LoRaWAN Node for Agro-Intelligence IoT

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of a Wireless Communication System for Automated Devices;2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM);2024-06-28

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