Design, Fabrication and Characterization of Surface Electrode Ion Trap Integrated with TSV-Reference-Cited by-同舟云学术

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Design, Fabrication and Characterization of Surface Electrode Ion Trap Integrated with TSV

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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Author:

Zhao Peng,Tao Jing,Li Hong Yu,Lim Yu Dian,Guidoni Luca,Tan Chuan Seng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9006769/9026560/09026716.pdf?arnumber=9026716

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Predictive Modelling of Optical Beams From Grating Structure Using Deep Neural Network;Journal of Lightwave Technology;2024-01-15

3. Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

4. Development of Grating for the Optical Addressing of Sr⁺ Ions With Data Analysis Techniques;IEEE Photonics Journal;2023-08

5. Development of mixed pitch grating for the optical addressing of trapped Sr⁺ ion with data analysis techniques;Optics Express;2023-07-03

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