Deep Reinforcement Learning-Based Ground-Via Placement Optimization for EMI Mitigation-Reference-Cited by-同舟云学术

Deep Reinforcement Learning-Based Ground-Via Placement Optimization for EMI Mitigation

Published:2023-04 Issue:2 Volume:65 Page:564-573
ISSN:0018-9375
Container-title:IEEE Transactions on Electromagnetic Compatibility
language:
Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Gu Zheming¹^ORCID,Zhang Ling¹^ORCID,Jin Hang¹^ORCID,Tao Tuomin¹^ORCID,Li Da¹^ORCID,Li Er-Ping¹^ORCID

Affiliation:

1. Key Laboratory of Advanced Micro/Nano Electronic Devices and Smart Systems and Applications, College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China

Funder

Zhejiang Provincial Natural Science Foundation of China

National Natural Science Foundation of China

Zhejiang Lab Project Fund

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/15/10105548/09959881.pdf?arnumber=9959881

Reference33 articles.

1. A new via fence structure for crosstalk reduction in high density stripline packages

2. Impact of Ground via Placement in Grounded Coplanar Waveguide Interconnects

3. Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures

4. EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

5. Genetic Algorithm- A Literature Review

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