New interferometric measurement technique for small diameter TSV-Reference-Cited by-同舟云学术

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New interferometric measurement technique for small diameter TSV

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014)
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Author:

Timoney Padraig,Fisher Daniel,Yeong-Uk Ko ,Vaid Alok,Thangaraju Sarasvathi,Smith Daniel,Kamineni Himani,Dingyou Zhang ,Alapati Ramakanth,Wonwoo Kim ,Ke Xiao ,Edmundson Holly,Smith Nigel,Peterson Brennan,Amin Hemant,Peak Jonathan,Johnson Tim

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6843030/6846940/06846973.pdf?arnumber=6846973

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Spectroscopic Reflectometry for Optimizing 3D Through-Silicon-Vias Process;Metrology;2023-11-22

2. Non-integral model-based scatterometry for CD metrology of single high-aspect-ratio microstructures;Surface Topography: Metrology and Properties;2023-05-05

3. Through-Silicon Vias: Drivers, Performance, and Innovations;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-07

4. BMD impact on silicon fin defect at TSV bottom;Electronics Letters;2014-06

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