3D ICs in the real world
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6843030/6846940/06846988.pdf?arnumber=6846988
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Congestion-Aware Vertical Link Placement and Application Mapping Onto 3-D Network-on-Chip Architectures;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-08
2. High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express;Nature Electronics;2024-02-19
3. 785-nm Frequency Comb-Based Time-of-Flight Detection for 3D Surface Profilometry of Silicon Devices;IEEE Photonics Journal;2022-10
4. Introduction;Wireless Interface Technologies for 3D IC and Module Integration;2021-09-30
5. Influence of 2.09-μm pulse duration on through-silicon laser ablation of thin metal coatings;Optics & Laser Technology;2021-01
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