Influence of 2.09-μm pulse duration on through-silicon laser ablation of thin metal coatings

Author:

Astrauskas I.,Považay B.,Baltuška A.,Pugžlys A.

Funder

FWF

FFG

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference31 articles.

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3. S. Pargfrieder, P. Kettner, M. Privett, J. Ting, Temporary bonding and debonding enabling TSV formation and 3D integration for ultra-thin wafers, in: 2008 10th Electronics Packaging Technology Conference, 2008, pp. 1301–1305.

4. Thin wafer handling — study of temporary wafer bonding materials and processes;Hermanowski,2009

5. SemiConductor Wafer Bonding: Science and Technology;Tong,1998

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