Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
46 articles.
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1. 3D integration of 2D electronics;Nature Reviews Electrical Engineering;2024-04-25
2. Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs;Proceedings of the 2024 International Symposium on Physical Design;2024-03-12
3. NGLIC: A Nonaligned-Row Legalization Approach for 3-D Interdie Connection;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-02
4. Construction of All Multilayer Monolithic RSMTs and Its Application to Monolithic 3D IC Routing;ACM Transactions on Design Automation of Electronic Systems;2023-12-18
5. TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12