Construction of All Multilayer Monolithic RSMTs and Its Application to Monolithic 3D IC Routing

Abstract

Monolithic three-dimensional (M3D) integration allows ultra-thin silicon tier stacking in a single package. The high-density stacking is acquiring interest and is becoming more popular for smaller footprint areas, shorter wirelength, higher performance, and lower power consumption than the conventional planar fabrication technologies. The physical design of M3D integrated circuits requires several design steps, such as three-dimensional (3D) placement, 3D clock-tree synthesis, 3D routing, and 3D optimization. Among these, 3D routing is significantly time consuming due to countless routing blockages. Therefore, 3D routers proposed in the literature insert monolithic interlayer vias (MIVs) and perform tier-by-tier routing in two substeps. In this article, we propose an algorithm to build a routing topology database (DB) used to construct all multilayer monolithic rectilinear Steiner minimum trees on the 3D Hanan grid. To demonstrate the effectiveness of the DB in various applications, we use the DB to construct timing-driven 3D routing topologies and perform congestion-aware global routing on 3D designs. We anticipate that the algorithm and the DB will help 3D routers reduce the runtime of the MIV insertion step and improve the quality of the 3D routing.