Author:
Deutsch Sergej,Chakrabarty Krishnendu
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
37 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-08
2. Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC;Microelectronics Reliability;2024-07
3. TSPC Trigger-Based Testing Scheme for Pre-Bond Testing and Diagnosis of TSVs;2023 2nd International Conference on Sensing, Measurement, Communication and Internet of Things Technologies (SMC-IoT);2023-12-29
4. 2D/2.5D/3D Heterogeneous Integration;Electronic Device Failure Analysis Technology Roadmap;2023-11-01
5. 2D/2.5D/3D Heterogeneous Integration;Electronic Device Failure Analysis Technology Roadmap;2023-11-01