Improving Liquid Film Thickness Uniformity of Semiconductor Etching Equipment Using Flow Field Visualization and CFD Simulation
Author:
Affiliation:
1. Department of Energy and Refrigerating Air-Conditioning Engineering, National Taipei University of Technology, Taipei, Taiwan
2. Marketing Department, LI-COR Biosciences, Lincoln, NV, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/66/9768876/09695997.pdf?arnumber=9695997
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