Computational Study of Chemical Uniformity Impacts on Electrodeposition-Reference-Cited by-同舟云学术

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Computational Study of Chemical Uniformity Impacts on Electrodeposition

Published:2024-08 Issue:3 Volume:37 Page:238-243
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Chalupa Adam¹^ORCID,Warner Joel¹,Martin Jarett¹

Affiliation:

1. Samsung Austin Semiconductor, LLC, Austin, TX, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/66/10636181/10556741.pdf?arnumber=10556741

Reference11 articles.

1. Analysis of copper plating baths

2. High‐Speed Selective Electroplating with Single Circular Jets

3. Modeling the electroplating of hexavalent chromium;Obaid

4. Effects of Additives and Convection on Cu Foil Fabrication with a Low Surface Roughness

5. An Effective Method For Developing Process Equipment With CFD Simulation

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