Inertial sensor technology using DRIE and wafer bonding with connecting capability-Reference-Cited by-同舟云学术

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Inertial sensor technology using DRIE and wafer bonding with connecting capability

Published:1999 Issue:4 Volume:8 Page:403-408
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Ishihara K.,Chi-Fan Yung ,Ayon A.A.,Schmidt M.A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx5/84/17524/00809054.pdf?arnumber=809054

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