A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework With SQP-Based Optimization Method-Reference-Cited by-同舟云学术

A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework With SQP-Based Optimization Method

Published:2021-03 Issue:3 Volume:40 Page:603-607
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Cai Junzhe¹^ORCID,Yan Changhao¹^ORCID,Tao Yudong¹^ORCID,Lin Yibo²^ORCID,Wang Sheng-Guo³,Pan David Z.⁴,Zeng Xuan¹^ORCID

Affiliation:

1. School of Microelectronics, Fudan University, Shanghai, China

2. Center for Energy-Efficient Computing and Applications, Peking University, Beijing, China

3. Department of Engineering Technology, University of North Carolina at Charlotte, Charlotte, NC, USA

4. Department of Electrical and Computer Engineering, University of Texas at Austin, Austin, TX, USA

Funder

National Major Science and Technology Special Project of China

National Natural Science Foundation of China Research Projects

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

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