MFA-MTJ Model: Magnetic-Field-Aware Compact Model of pMTJ for Robust STT-MRAM Design

Author:

Wu Lizhou1ORCID,Rao Siddharth2,Taouil Mottaqiallah3ORCID,Marinissen Erik Jan2ORCID,Kar Gouri Sankar2,Hamdioui Said3ORCID

Affiliation:

1. School of Computer, National University of Defense Technology, Changsha, China

2. Compute and Memory Department, IMEC, Leuven, Belgium

3. Computer Engineering Department, Delft University of Technology, Delft, The Netherlands

Funder

Natural Science Foundation of China

National Key Research and Development Program of China

Guangdong Major Project of Basic and Applied Basic Research

Natural Science Foundation of Guangdong Province

Key-Area Research and Development Program of Guangdong Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Reference48 articles.

1. Dynamic compact model of spin-transfer torque based magnetic tunnel junction (MTJ);faber;Proc Int l Conf Systems Integration,2009

2. Temperature dependence of the voltage-controlled perpendicular anisotropy in nanoscale MgO|CoFeB|Ta magnetic tunnel junctions

3. Characterization, Modeling and Test of Synthetic Anti-Ferromagnet Flip Defect in STT-MRAMs

4. Asymmetry of MTJ switching and its implication to STT-RAM designs;zhang;Proc Design Autom Test Europe Conf,2012

5. Spin torque switching of perpendicular Ta∣CoFeB∣MgO-based magnetic tunnel junctions

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. TEMT: A Transient Electronic–Magnetic–Thermal-Coupled Simulation Framework for STT-MTJs;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-05

2. Device-Aware Test for Back-Hopping Defects in STT-MRAMs;2023 Design, Automation & Test in Europe Conference & Exhibition (DATE);2023-04

3. Design of STT-MRAM Using Hybrid MTJ/CMOS for Applications beyond CMOS;2022 International Conference on Innovations in Science and Technology for Sustainable Development (ICISTSD);2022-08-25

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