Additively Manufactured “Smart” RF/mm-Wave Packaging Structures: A Quantum Leap for On-Demand Customizable Integrated 5G and Internet of Things Modules
Author:
Affiliation:
1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx7/6668/9819810/09819817.pdf?arnumber=9819817
Reference38 articles.
1. Nanotechnology-Empowered Flexible Printed Wireless Electronics: A Review of Various Applications of Printed Materials
2. Fully Inkjet-Printed Ramp Interconnects for Wireless Ka-Band MMIC Devices and Multi-Chip Module Packaging
3. Millimeter-wave performance of chip interconnections using wire bonding and flip chip
4. A study on an Ultra Thin PoP using through mold via technology
5. Characterization of transfer molding effects on RF performance of power amplifier module
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1. Low-Cost Method for Internal Surface Roughness Reduction of Additively Manufactured All-Metal Waveguide Components;IEEE Transactions on Microwave Theory and Techniques;2024-08
2. Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
3. Design thinking-driven development of a modular X-Band antenna using multi-material 3D printing;International Journal on Interactive Design and Manufacturing (IJIDeM);2023-08-22
4. Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications;Scientific Reports;2023-08-02
5. Dielectric and Mechanical Properties of 3D Printed Nanocomposites with Varied Particle Diameter;Langmuir;2023-01-09
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