Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in Air
Author:
Affiliation:
1. Univ. Grenoble Alpes,CNRS, Grenoble INP*, G2Elab,Grenoble,France
2. Univ Lyon, Ecole Centrale de Lyon, INSA Lyon Université Lyon,Ecully,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10410432/10410177/10410485.pdf?arnumber=10410485
Reference6 articles.
1. An 800V/300 kW, 44 kW/L Air-Cooled SiC Power Electronics Building Block (PEBB)
2. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
3. Low voltage switching cell for high density and modular 3D power module with integrated air-cooling;Bikinga,2020
4. Comparison of Different Insulating Liquids for PCB Embedded Power Modules
5. Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquids
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