Comparison of Different Insulating Liquids for PCB Embedded Power Modules-Reference-Cited by-同舟云学术

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Comparison of Different Insulating Liquids for PCB Embedded Power Modules

Published:2020-10-18 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
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Author:

Agri Ouassim,Vagnon Eric,Zouaghi Ayyoub,Auge Jean-Louis

Funder

French National Center for Scientific Research (CNRS)

SEEDS and the French Ministry of Higher Education, Research and Innovation (MESRI)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9437372/9437373/09437524.pdf?arnumber=9437524

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in Air;2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP);2023-10-15

2. A Study on Simultaneous Measurements of PD Light Emission and Charge in Resin Substrate;2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP);2021-12-12

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