Study of Asymmetric Cell Structure Tilt Implanted 4H-SiC Trench MOSFET
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/8698471/08676293.pdf?arnumber=8676293
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. SiC superjunction MOSFET with Schottky diode for improving short-circuit and reverse recovery ruggedness;Micro and Nanostructures;2024-07
2. SiC Trench MOSFET with Depletion-Mode pMOS for Enhanced Short-Circuit Capability and Switching Performance;Electronics;2023-11-24
3. The Influence of Special Environments on SiC MOSFETs;Materials;2023-09-13
4. Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche Stress;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
5. 1.2 kV 4H–SiC Super Junction UMOSFET with a Low-K dielectric pillar;Micro and Nanostructures;2023-04
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