MMIC chipset for 300 GHz indoor wireless communication
Author:
Affiliation:
1. Institute of Robust Power Semiconductor Systems, University of Stuttgart, USA
2. Technische Universität Braunschweig, Germany
3. Fraunhofer Institute for Applied Solid-State Physics (IAF), Tullastrasse 72, D-79108 Freiburg, Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7352814/7360353/07360494.pdf?arnumber=7360494
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