Integrated Front-End Approaches for Wireless 100 Gb/s and Beyond: Enabling Efficient Ultra-High Speed Wireless Communication Systems
Author:
Affiliation:
1. Institute of Microwaves and Photonics, Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany
2. Institute for Electronics Engineering, Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx7/6668/10183642/10183702.pdf?arnumber=10183702
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1. SiGe BiCMOS Current Status and Future Trends in Europe
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3. Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology
4. A Compact 281–319 GHz Low-Power Downconverter MMIC for Superheterodyne Communication Receivers
5. A New Field-Effect Transistor with Selectively Doped GaAs/n-AlxGa1-xAs Heterojunctions
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