Author:
Dai Jiayun,Wang Fei,Xu Lida,Zhao Desheng,Han Ping,Chen Tangshen
Cited by
2 articles.
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1. Transient Thermodynamic Simulation of Micro LED Array Bonding;2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-11-27
2. Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications;Advances in Manufacturing;2022-12-16