A Combination of Implant Shadow and Skin Effects Leading to HV Devices Failure during the ESD Event
Author:
Affiliation:
1. Vanguard International Semiconductor Corp.,DE Department,HsinChu City,Taiwan
2. National Yang Ming Chiao Tung University,Department of Electrical and Computer Eng.,HsinChu City,Taiwan
3. Richtek Technology Corp.,ESD Department,ChuPei City,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10248978/10248979/10249114.pdf?arnumber=10249114
Reference24 articles.
1. The effect of implant angle and resist shadowing in submicron implant technology;lee;Master Dissertation,2006
2. System-Level ESD-Induced Voltage Fluctuation to the Power of Integrated Circuits on System Board
3. Doping channeling as a function of implant angle for low energy applications;walther;Proc Int Conf Ion Implantation Technol,1998
4. The positive trigger voltage lowering effect for latch-up;lee;Proc IEEE Int Symp Phys and Failure Anal Integr Circuits,2004
5. RESURF Region Variation Induced Current Crowding Effect on HV p-LDMOS
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. RESURF Region Variation Induced Current Crowding Effect on HV p-LDMOS;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
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