1. Uniform delayering of copper metallization
2. Preparation, Imaging, and Design Extraction of the Front-End-of-Line and Middle-of-Line in a 14 nm Node FinFET Device
3. Impacts of Substrate Thinning on FPGA Performance and Reliability;leonhardt;Proceedings of the ISTFA 2021 ISTFA 2021 Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis,2021
4. Emerging monolithic 3D integration: Opportunities and challenges from the computer system perspective;yuanqing;Integration,2022
5. A Sample Preparation Workflow for Delayering a 45 nm Node Serial Peripheral Interface (SPI);patel;Electronic Device Failure Analysis(EDFA) Magazaine,2021