Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges-Reference-Cited by-同舟云学术

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Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges

Published:2014-12 Issue:4 Volume:8 Page:14-20
ISSN:1932-4510
Container-title:IEEE Nanotechnology Magazine
language:
Short-container-title:IEEE Nanotechnology Mag.

Author:

Kumar Vobulapuram Ramesh,Kaushik Brajesh Kumar,Majumder Manoj Kumar

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx7/4451717/6960991/06919274.pdf?arnumber=6919274

Cited by 38 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint;Microelectronic Engineering;2024-07

2. Performance Analysis of Graphene Nanoribbon Based through Silicon Vias for 3D-ICs;Russian Microelectronics;2024-04

3. Industry 4.0 and Beyond—Present Trends, Emerging Solutions and Future Technologies in the Area of the Industrial Automation;2024 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON);2024-01-31

4. Modeling and performance analysis of coupled multilayer graphene nanoribbon (MLGNR) interconnects with intercalation doping;Microelectronics Journal;2023-11

5. Characterization of Transmission Lines in Microelectronic Circuits Using the ARTEMIS Solver;IEEE Journal on Multiscale and Multiphysics Computational Techniques;2023

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