Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution-Reference-Cited by-同舟云学术

Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 45th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Gharaibeh Ali¹,Rigler Daniel¹,Medgyes Balint¹,Harsanyi Gabor¹

Affiliation:

1. Budapest University of Technology and Informatics,Faculty of Electrical Engineering and Informatics,Department of Electronics Technology,Budapest, Műegyetem rkp. 3.,Hungary,H-1111

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9812704/9812706/09812805.pdf?arnumber=9812805

Reference14 articles.

1. Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable?

2. Electrochemical migration behavior of Sn-based lead-free solder

3. Corrosion of candidate lead-free solder alloys in saline solution;špoták;METAL 2015 - 24th International Conference on Metallurgy and Materials Conference Proceedings,0

4. ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS

5. Electrochemical migration failure mechanism and dendrite composition characteristics of Sn96.5Ag3.0Cu0.5 alloy in thin electrolyte films

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