ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS-Reference-Cited by-同舟云学术

ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS

Published:2019-07 Issue:06 Volume:26 Page:1850208
ISSN:0218-625X
Container-title:Surface Review and Letters
language:en
Short-container-title:Surf. Rev. Lett.

Author:

LIAO BOKAI¹,JIA WENFENG²,SUN RUIYAN³,CHEN ZHENYU¹^ORCID,GUO XINGPENG¹

Affiliation:

1. Hubei Key Laboratory of Materials Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China

2. Sinopec Research Institute of Petroleum Engineering, Beijing 100101, P. R. China

3. Survey and Design Institute, Jilin Oilfield, Songyuan 138001, P. R. China

Abstract

The electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder alloy under thin electrolyte layers was investigated using a technique based on the coupling of in situ electrochemical measurements and optical observation. Results showed that the mean time to failure first increased and then decreased as thickness of the electrolyte layer increased, the maximum value was present at 200[Formula: see text][Formula: see text]m. The higher the bias voltage applied, the faster was the rate of dendrite growth. And, Sn leaded the ECM of SAC305 solder alloy. Mechanisms relevant have been proposed to explain the ECM behavior of Sn-3.0Ag-0.5Cu solder alloy.

Funder

National Natural Science Foundation of China

PetroChina Company Limited

Publisher

World Scientific Pub Co Pte Lt

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

https://www.worldscientific.com/doi/pdf/10.1142/S0218625X18502086

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1. On the electrochemical migration mechanism of tin in electronics

2. The comparison of electrochemical migration mechanism between electroless silver plating and silver electroplating