Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits-Reference-Cited by-同舟云学术

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Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits

Published:2008-03 Issue: Volume: Page:
ISSN:1065-2221
Container-title:2008 Twenty-fourth Annual IEEE Semionductor Thermal Measurement and Management Symposium
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Author:

Schweitzer Dirk,Pape Heinz,Chen Liu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4476516/4509347/04509389.pdf?arnumber=4509389

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