Study of Thickening Soldermask Coated Microstrip Lines on High-Speed PCBs for Crosstalk Reduction in DDR5

Author:

Yu Xiao-Bo,Cai Qiang-Ming,Ren Yinglei,Ye Xiaoning,Fan Jun

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. An Energy Efficient DDR5 I/O Performance Boost in Clamshell Configuration by Charge Pumping From Non-Target Device;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Time Domain Assessment of Minimum FEXT by Tabbed Line Design;2024 IEEE 28th Workshop on Signal and Power Integrity (SPI);2024-05-12

3. Using Neural Networks for Far-End Crosstalk Compensation in High-Speed MIMO Channels;IEEE Transactions on Signal and Power Integrity;2024

4. Crosstalk Reduction in High-Density Radio Frequency Printed Circuit Boards: Leveraging FR4 Coating Layers;Coatings;2023-10-20

5. Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR);2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

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