Wafer Level Back to Back Hybrid Bonding for Multiple Wafer Stacking
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9314953/9314863/09315154.pdf?arnumber=9315154
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. 3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration;Microelectronics International;2022-12-27
4. Process Development and Integration for Wafer-to-Wafer Hybrid Bonding;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
5. Wafer-to-Wafer Hybrid Bonding Challenges for 3D IC Applications;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
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