Double Mold Antenna in Package for 77 GHz Automotive Radar-Reference-Cited by-同舟云学术

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Double Mold Antenna in Package for 77 GHz Automotive Radar

Published:2020-12-02 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
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Author:

Ho Soon Wee,Boon Soh Siew,Long Lau Boon,Hsiang-Yao Hsiao,Choong Chong Ser,Pei Siang Sharon Lim,Guan Lim Teck,Chong Chai Tai

Funder

Agency for Science, Technology and Research (A*STAR)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9314953/9314863/09315071.pdf?arnumber=9315071

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Low-Loss DC-to-300 GHz InP/Si Interconnection Based on Wafer Level Packaging Using Chip-first/Facedown Process;2024 IEEE/MTT-S International Microwave Symposium - IMS 2024;2024-06-16

2. 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

3. Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications;Electronics;2024-02-22

4. A Scalable 16-Element 76-to-81 GHz Phased Array Antenna-in-Package for Automotive Radar;2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI);2023-07-23

5. Novel Photo-definable Low Dk & Df Polyimide for Advanced Package of High Frequency Application;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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