Global routing by iterative improvements for two-layer ball grid array packages-Reference-Cited by-同舟云学术

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Global routing by iterative improvements for two-layer ball grid array packages

Published:2006-04 Issue:4 Volume:25 Page:725-733
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Kubo Y.,Takahashi A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx5/43/33826/01610736.pdf?arnumber=1610736

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Layer and Length-Deviation Limit Aware Interposer Routing for Bend and Wirelength Minimization;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design;ACM Transactions on Design Automation of Electronic Systems;2023-09-08

3. Unet-Astar: A Deep Learning-Based Fast Routing Algorithm for Unified PCB Routing;IEEE Access;2023

4. Challenges and Approaches in VLSI Routing;Proceedings of the 2022 International Symposium on Physical Design;2022-04-13

5. Practical Substrate Design Considering Symmetrical and Shielding Routes;2022 Design, Automation & Test in Europe Conference & Exhibition (DATE);2022-03-14

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