An interconnect energy model considering coupling effects
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Link
http://xplorestaging.ieee.org/ielx5/43/21835/01013890.pdf?arnumber=1013890
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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3. Study on the Thermal Transient Response of TSV Considering the Effect of Electronic-Thermal Coupling;JSTS:Journal of Semiconductor Technology and Science;2015-06-30
4. A novel interconnect-optimal power model considering self-heating effect;Acta Physica Sinica;2013
5. An improved Elmore delay model for VLSI interconnects;Mathematical and Computer Modelling;2010-04
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