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An interconnect energy model considering coupling effects

Published:2002-07 Issue:7 Volume:21 Page:763-776
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:en
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Uchino T.,Cong J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx5/43/21835/01013890.pdf?arnumber=1013890

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Study on the Thermal Transient Response of TSV Considering the Effect of Electronic-Thermal Coupling;JSTS:Journal of Semiconductor Technology and Science;2015-06-30

4. A novel interconnect-optimal power model considering self-heating effect;Acta Physica Sinica;2013

5. An improved Elmore delay model for VLSI interconnects;Mathematical and Computer Modelling;2010-04

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