The microstructure of Cu joint soldered with a new Cu coated Ni foam reinforced Sn composite solder-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

The microstructure of Cu joint soldered with a new Cu coated Ni foam reinforced Sn composite solder

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

He Huang¹,Tan Kewei²,He Yingxian¹,Zhao Lei³,Wang Wen⁴,Xiao Yong⁵

Affiliation:

1. Hubei Three Gorges Polytechnic,College of Mechanical and Electrical Engineering,Yichang,China

2. Southeast University,Chengxian College,Nanjing,China

3. HXF SAW CO., LTD, China Metallurgical Geology Bureau,Technology Research Center,Yichang,China

4. Hubei Three Gorges Polytechnic,College of Economics and Management,Yichang,China

5. Wuhan University of Technology,School of Materials Science and Engineering,Wuhan,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492134.pdf?arnumber=10492134

Reference9 articles.

1. Materials, processing and reliability of low temperature bonding in 3D chip stacking

2. A review: On the development of low melting temperature Pb-free solders

3. Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

4. Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

5. The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP