Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer-Reference-Cited by-同舟云学术

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Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Zhao Shuaijie¹,Chen Chuantong¹,Haga Motoharu²,Ueshima Minoru²,Suzuki Hirose³,Takenaka Hiroto³,Suganuma Katsuaki¹

Affiliation:

1. SANKEN Osaka University,Osaka,Japan

2. AMP Daicel Corporation,Osaka,Japan

3. Material SBU Daicel Corporation,Osaka,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492432.pdf?arnumber=10492432

Reference5 articles.

1. Encapsulation Technology of Epoxy Resin for High Temperature Operating Power Modules;Kaji

2. Ultra compact and high reliable SiC MOSFET power module with 200°C operating capability

3. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

4. Effect of copper oxides on the thermal oxidative degradation of the epoxy resin

5. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors

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