A V Band Ball Grid Array Interconnection Design of Ceramic Package with High-performance
Author:
Affiliation:
1. CETC,The 13th Research Institute,Shijiazhuang,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492401.pdf?arnumber=10492401
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3. Design on Millimeter Wave Vertical Connection Using the Technology of BGA[C];Liu
4. Broadband Vertical Transition between Substrates in Application of SIP Technology[J];Zhou;Research and progress in solid State electronics,2012
5. 3D strip meander delay line structure for multilayer LTCC-based SiP applications
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