Author:
Gawon Kim ,Lu Albert Chee W.,Fan Wei ,Wai Lai L.,Joungho Kim
Cited by
7 articles.
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1. A V Band Ball Grid Array Interconnection Design of Ceramic Package with High-performance;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Design of a Highly Integrated Multifunctional Microwave Digital Composite Board for Active Phased Array Antenna;2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM);2020-10-23
3. LTCC PoP Technology-Based Novel Approach for mm-Wave 5G System for Next Generation Communication System;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
4. Low Loss Compact Meander Stripline Delay Lines Using LTCC;2014 IEEE 17th International Conference on Computational Science and Engineering;2014-12
5. AN OVERALL LTCC PACKAGE SOLUTION FOR X-BAND TILE T/R MODULE;Progress In Electromagnetics Research Letters;2013