Carbazole-grafted Polyimide with Enhanced Adhesion to Smooth Copper
Author:
Affiliation:
1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492188.pdf?arnumber=10492188
Reference7 articles.
1. Emerging challenges and materials for thermal management of electronics
2. Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
3. Delamination of polyimide/Cu films under mixed mode loading
4. Asymmetric Metaconductors Featuring Wideband Skin Effect Suppression
5. The dominant factor for mechanical property of polyimide films containing heterocyclic moieties: In-plane orientation, crystallization, or hydrogen bonding
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