An accurate numerical prediction for the thermal conductivity of thermal interface materials-Reference-Cited by-同舟云学术

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An accurate numerical prediction for the thermal conductivity of thermal interface materials

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Lu Xiaoxin¹,Huang Jiabin²,Cheng Nan³,Ding Dongdong²,Lu Jibao²,Rong Sun⁴

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology,Shenzhen,P.R.China

2. Shenzhen Institute of Advanced Electronic Materials,Shenzhen,P.R.China

3. Southeast University,School of Electronic Science & Engineering,Nanjing,P.R.China

4. Chinese Academy of Sciences,Shenzhen Institutes of Advanced Technology,Shenzhen,P.R.China

Funder

National Natural Science Foundation of China

Youth Innovation Promotion Association

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492417.pdf?arnumber=10492417

Reference11 articles.

1. Novel nanostructured thermal interface materials: a review

2. Present and future thermal interface materials for electronic devices

3. High thermal conductivity in indium-based metal/diamond composites by good wettability of diamond with indium

4. Orientated growth the 3D diamond/graphene hybrid arrays and the application in thermal interface materials

5. Aligning diamond particles inside BN honeycomb for significantly improving thermal conductivity of epoxy composite

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