Simulation of morphology evolution and pore segregation of Ag sinter joint at high temperature-Reference-Cited by-同舟云学术

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Simulation of morphology evolution and pore segregation of Ag sinter joint at high temperature

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Wang Ye¹,Chen Chuantong²,Fu Guicui³,Wan Bo³,Suganuma Katsuaki²

Affiliation:

1. Beihang University The Institute of Scientific and Industrial Research, Osaka University,The School of Reliability and Systems Engineering,Osaka,Japan

2. Osaka University,The Institute of Scientific and Industrial Research,Osaka,Japan

3. Beihang University,The School of Reliability and Systems Engineering,Beijing,China

Funder

China Scholarship Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492393.pdf?arnumber=10492393

Reference10 articles.

1. Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

2. Brief Review of Nanosilver Sintering: Manufacturing and Reliability

3. Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

4. The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applications

5. Free Energy of a Nonuniform System. I. Interfacial Free Energy

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