The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applications
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference16 articles.
1. Microscale Ag particle paste for sintered joints in high-power devices
2. Effect of electroplated Au layer on bonding performance of Ag pastes
3. Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
4. Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles
5. Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C
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