Study of the effect of Si/Dia interface structure on heat dissipation-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Study of the effect of Si/Dia interface structure on heat dissipation

Published:2023-08-08 Issue: Volume:31 Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Wu Yufeng¹,Xie An¹,Jian Xiaodong²,Yang Xiaofeng³

Affiliation:

1. Xiamen University of Technology,School of Material Science and Engineering,Xiamen,China

2. China Electronic Reliability and Environment Testing Research Institute,Guangzhou,China

3. China Electronic Product Reliability and Environmental Testing Research Institute,Guangzhou,China

Funder

China Postdoctoral Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492300.pdf?arnumber=10492300

Reference13 articles.

1. Nanoscale thermal transport. II. 2003–2012

2. Design and analysis of heat sinks [M];KRAUS,1995

3. Heat dissipation characteristics of packaging modules for power electronic devices [J];Pan;Communication Power Technology,2014

4. Review on design and heat transfer analysis of solid and perforated fins for the enhancement of thermal performance of heat sinks

5. New developments in thermal management technology for microsystems [J];Huaiqiang;Piezoelectricity and Sound and Light,2018

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP