Author:
Bhambere Madhao B.,Chaudhari S. S.,Awari G. K.
Cited by
2 articles.
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1. Study of the effect of Si/Dia interface structure on heat dissipation;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Condenser cooling technologies for concentrating solar power plants: a review;Environment, Development and Sustainability;2021-08-06