Transmission Structures Using Parylene C and TSV for Silicon-based Low-loss and Low-profile Heterogeneous Integrations at Ka-band-Reference-Cited by-同舟云学术

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Transmission Structures Using Parylene C and TSV for Silicon-based Low-loss and Low-profile Heterogeneous Integrations at Ka-band

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Wang Qi¹,Wen Bo²,Chen Lang²,Wang Wei³,Jin Yufeng¹

Affiliation:

1. Peking University Shenzhen Graduate School,Shenzhen,China

2. Peking University,School of Integrated Circuits,Beijing,China

3. Peking University National Key Laboratory of Advanced Micro and Nano Manufacture Technology Beijing Advanced Innovation Center for Integrated Circuits,School of Integrated Circuits,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492167.pdf?arnumber=10492167

Reference6 articles.

1. Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications

2. Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration

3. Low-Loss Heterogeneous Integrations With High Output Power Radar Applications at W-Band

4. Embedded Silicon Fan-Out (eSiFO®) Technology for Wafer-Level System Integration

5. Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

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