Thermal characterization of vertical multichip modules MCM-V-Reference-Cited by-同舟云学术

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Thermal characterization of vertical multichip modules MCM-V

Published:1995 Issue:4 Volume:18 Page:765-772
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Cahill C.,Compagno A.,O'Donovan J.,Slattery O.,O'Mathuna S.C.,Barrett J.,Serthelon I.,Val C.,Tigners J.-P.,Stern J.,Ivey P.,Masgrangeas M.,Coello-Vera A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/10163/00477462.pdf?arnumber=477462

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heat Conduction in Multilayered Rectangular Domains;Journal of Electronic Packaging;2007-04-07

2. On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules;Journal of Electronic Packaging;2004-09-01

3. Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip;Japanese Journal of Applied Physics;2000-04-30

4. A review of 3-D packaging technology;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1998

5. Development of distributed sensing systems of autonomous micro-modules;53rd Electronic Components and Technology Conference, 2003. Proceedings.

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