Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip-Reference-Cited by-同舟云学术

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Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip

Published:2000-04-30 Issue:Part 1, No. 4B Volume:39 Page:2473-2477
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Lee Kang Wook,Nakamura Tomonori,Sakuma Katsuyuki,Park Ki Tae,Shimazutsu Hiroaki,Miyakawa Nobuaki,Kim Ki Yoon,Kurino Hiroyuki,Koyanagi Mitsumasa

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Grating-assisted-cylindrical-resonant-cavities interlayer coupler;Applied Optics;2018-06-14

2. Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review;Journal of Electronic Packaging;2018-03-01

3. Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05

4. Enhanced oxidation of Si using low-temperature oxidation catalyst SrTi1−xMgxO3−δ;Japanese Journal of Applied Physics;2016-04-21

5. Analysis of the Performance, Power, and Noise Characteristics of a CMOS Image Sensor With 3-D Integrated Image Compression Unit;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-02

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