Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
24 articles.
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1. Towards measurements of global coefficient of thermal expansion of QFN;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Lead (
Pb
)‐Free Solders for High Reliability and High‐Performance Applications;Lead‐free Soldering Process Development and Reliability;2020-07-03
3. Coupled thermal-mechanical simulation methodology to estimate BGA reliability of 2.5D Packages;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
4. A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint;Journal of Electronic Packaging;2019-05-17
5. BGA Interconnection Reliability in Mirrored Module Configurations;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-10